Line 3: |
Line 3: |
| }} | | }} |
| __TOC__ | | __TOC__ |
| + | |
| + | {{Template:2023 12 18 PCN Housing |
| + | <!------------------------DEVICE-----------------------> |
| + | | name = TSW200 |
| + | | month = July |
| + | | Full_date = 2024.03.19 |
| + | | File_Full_date = 2024_03_19 |
| + | }} |
| + | |
| + | ==2024.03.19 TSW200 DIN Rail bracket change== |
| + | |
| + | Starting from 2024 Q2, TSW200 switch will be produced with integrated DIN Rail bracket. |
| + | {| class="wikitable" |
| + | |- |
| + | | style="width: 1219px; text-align: left; background: #eeece1;" |PCN Number: PCN_TSW200_2023.03.19<br> |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! colspan="3" style="text-align: left; background: #eeece1;" |Change description |
| + | |- |
| + | | style="text-align: left; background: white;" | Change type |
| + | | style="text-align: left; background: white;" colspan="2" | Mechanical |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description |
| + | | style="width: 908px; text-align: left; background: white;" colspan="2" | |
| + | Beginning in Q2 of 2024, the current screw-on DIN Rail bracket in the TSW200 switch will be replaced with an integrated one. The new DIN Rail bracket will be shifted to the left by 0.96 mm. |
| + | |
| + | Please note that this change will be implemented gradually, throughout a 3-month transitional period starting from Q2 2024, batch 33. During this period, your shipments of TSW210 may consist of either the current screw-on DIN Rail bracket or the new one described above. For inquiries regarding custom order codes, please contact your designated sales representative. |
| + | |- |
| + | | style="text-align: left; background: white;" | Old DIN Rail bracket: <br> [[File:TSW2_panel_old_v2.png|center|230px|link=Special:FilePath/TSW2_panel_old_v2.png]]<br> |
| + | | style="text-align: left; background: white;" | New DIN Rail bracket: <br><br> [[File:TSW2_panel_new.png|center|210px|link=Special:FilePath/TSW2_panel_new.png]]<br> |
| + | |- |
| + | | style="text-align: left; background: white;" | Dimensions of old DIN Rail bracket: |
| + | <br> |
| + | [[File:dimensions_old_DIN.png|center|450px|link=Special:FilePath/dimensions_old_DIN.png]]<br> |
| + | | style="text-align: left; background: white;" | Dimensions of new DIN Rail bracket: <br><br> [[File:dimensions_new_DIN.png|center|450px|link=Special:FilePath/dimensions_new_DIN.png]]<br> |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="3" | Packaging dimensions will not change. |
| + | |- |
| + | | style="text-align: left; background: white;" | Change reasons |
| + | | style="text-align: left; background: white;" colspan="2" | Structural improvement |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: #eeece1;" colspan="3" | Affected products information |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Model |
| + | | style="width: 448px; text-align: left; background: white;" | Affected order codes |
| + | | style="width: 448px; text-align: left; background: white;" | Order code changes |
| + | |- |
| + | | style="text-align: left; background: white;" | TSW200 |
| + | | style="text-align: left; background: white;" | TSW200 ****** |
| + | | style="text-align: left; background: white;" | No changes |
| + | |- |
| + | | style="text-align: left; background: white;" | Upcoming change date |
| + | | style="text-align: left; background: white;" colspan="2" | 2024 Q2 |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: #eeece1;" colspan="3" | Change impact |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Risk assessment |
| + | | style="width: 908px; text-align: left; background: white;" colspan="2"| |
| + | The product handling process may require review. Marketing materials, such as photos, might need replacement. |
| + | |- |
| + | | style="text-align: left; background: white;" | Suggested implementation plan |
| + | | style="text-align: left; background: white;" colspan="2"| Information included in this PCN will help adapt to the upcoming changes. For more detailed information, please contact your sales representative. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="width: 1141px; text-align: left; background: #eeece1;" colspan="3" | Acknowledgement of PCN receipt |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
| + | |- |
| + | |} |
| + | |
| + | To download the pdf version of this notification, [[Media:TSW200_DIN_Rail_bracket_change.pdf|click here]]. |
| + | |
| + | ==2024.01.18: EEPROM Change== |
| + | |
| + | Starting from 2024 Q2, TSW200 switch will be produced with a different EEPROM hardware component. |
| + | |
| + | {| class="wikitable" |
| + | |- |
| + | | style="width: 1219px; text-align: left; background: #eeece1;" |PCN Number: PCN_TSW200_2024_01_18_EN <br> |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! colspan="2" style="text-align: left; background: #eeece1;" |Change description |
| + | |- |
| + | | style="text-align: left; background: white;" |Change type |
| + | | style="text-align: left; background: white;" |Hardware change |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Detailed description |
| + | | style="width: 908px; text-align: left; background: white;" | In order to reduce lead times for TSW200 switch, starting from 2024 Q2, the EEPROM hardware component will be replaced with an analog part.<br> |
| + | |- |
| + | | style="text-align: left; background: white;" | Change reasons |
| + | | style="text-align: left; background: white;" | Decreasing product lead time |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: #eeece1;" colspan="3" | Affected products information |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Model |
| + | | style="width: 448px; text-align: left; background: white;" | Affected order codes |
| + | | style="width: 448px; text-align: left; background: white;" | Order code changes |
| + | |- |
| + | | style="text-align: left; background: white;" | TSW200 |
| + | | style="text-align: left; background: white;" | TSW200 ***** |
| + | | style="text-align: left; background: white;" | No changes |
| + | |- |
| + | | style="text-align: left; background: white;" | Upcoming change date |
| + | | style="text-align: left; background: white;" colspan="2" | 2024 Q2 |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: #eeece1;" colspan="3" | Change impact |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Risk assessment |
| + | | style="width: 908px; text-align: left; background: white;" colspan="2"| No risk factors have been identified during the evaluation of this change. However, it is recommended to conduct an independent review to ensure alignment with specific circumstances and requirements |
| + | |- |
| + | | style="text-align: left; background: white;" | Suggested implementation plan |
| + | | style="text-align: left; background: white;" colspan="2"| No implementation plan needed. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="width: 1141px; text-align: left; background: #eeece1;" colspan="3" | Acknowledgement of PCN receipt |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
| + | |- |
| + | |} |
| + | |
| + | To download the pdf version of this notification, [[Media:PCN TSW200 2024 01 18 EN.pdf|click here]]. |
| + | {{Template: 20230802_Product_packaging_changes |
| + | <!------------------------DEVICE-----------------------> |
| + | | name = TSW200 |
| + | }} |
| + | |
| + | ==2023.05.20: Product packaging changes == |
| + | |
| + | Starting in Q2 of 2023, changes will be made to the packaging of the TSW200 product. |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: white;" colspan="3" | Change description |
| + | |- |
| + | | style="text-align: left; background: white;" | Change type |
| + | | style="text-align: left; background: white;" colspan="2" | Packaging |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description |
| + | | style="width: 908px; text-align: left; background: white;" colspan="2" | Starting from Q2 2023, the current polyurethane foam insert used for TSW200 will be substituted with a honeycomb insert made from cardboard. |
| + | |- |
| + | | style="text-align: left; background: white;" | Current: <br> [[File:Polyurethane foam insert TSW v1.jpg|left|300px|link=Special:FilePath/Polyurethane foam insert TSW v1.jpg]] |
| + | | style="text-align: left; background: white;" | New: <br> [[File:RUTX09-RUTX11-honeycomb-insert-v1.jpg|left|500px|link=Special:FilePath/RUTX09-RUTX11-honeycomb-insert-v1.jpg]] |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="2" | Packaging dimensions will not change. |
| + | |- |
| + | | style="text-align: left; background: white;" | Change reasons |
| + | | style="text-align: left; background: white;" colspan="2" | This change will lead to an improvement in the structural stability, impact resistance, and environmental impact reduction. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: white;" colspan="3" | Affected products information |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Model |
| + | | style="width: 448px; text-align: left; background: white;" | Current order code |
| + | | style="width: 448px; text-align: left; background: white;" | Order code changes |
| + | |- |
| + | | style="text-align: left; background: white;" | TSW200 |
| + | | style="text-align: left; background: white;" | TSW200 000040 |
| + | | style="text-align: left; background: white;" | No changes |
| + | |- |
| + | | style="text-align: left; background: white;" | Upcoming change date |
| + | | style="text-align: left; background: white;" colspan="2" | 2023 Q2 |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! colspan="3" style="text-align: left; background: white;" |Change impact |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" |Risk assessment |
| + | | colspan="2" style="width: 908px; text-align: left; background: white;" | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement. |
| + | |- |
| + | | style="text-align: left; background: white;" |Suggested implementation plan |
| + | | colspan="2" style="text-align: left; background: white;" | |
| + | The information included in this PCN will help adapt to the upcoming changes. For more detailed information, please get in touch with your sales representative. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="width: 1141px; text-align: left; background: white;" colspan="3" | Acknowledgement of PCN receipt |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
| + | |- |
| + | |} |
| + | |
| + | To download the pdf version of this notification, [[Media:PCN TSW200 2023 05 20 EN Packaging 040.pdf|click here]]. |
| + | |
| + | |
| + | |
| + | ==2023.05.17: Product packaging changes == |
| + | |
| + | Starting from Q3 2023 TSW200 product packaging will be changed. |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: white;" colspan="3" | Change description |
| + | |- |
| + | | style="text-align: left; background: white;" | Change type |
| + | | style="text-align: left; background: white;" colspan="2" | Packaging |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description |
| + | | style="width: 908px; text-align: left; background: white;" colspan="2" | Starting from Q3 2023 TSW200 polyurethane foam insert will be replaced by honeycomb insert made from cardboard. |
| + | |- |
| + | | style="text-align: left; background: white;" | Current: <br><br> [[File:Insert_Plastic_OLD_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Plastic_OLD_TSW200.TSW210_v1.png]] |
| + | | style="text-align: left; background: white;" | New: <br><br> [[File:Insert_Carton_NEW_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Carton_NEW_TSW200.TSW210_v1.png]] |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="2" | Packaging dimensions will not change. |
| + | |- |
| + | | style="text-align: left; background: white;" | Change reasons |
| + | | style="text-align: left; background: white;" colspan="2" | This change will improve structural stability, enhance impact resistance, and reduce environmental impact. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: white;" colspan="3" | Affected products information |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Model |
| + | | style="width: 448px; text-align: left; background: white;" | Current order code |
| + | | style="width: 448px; text-align: left; background: white;" | New order code |
| + | |- |
| + | | style="text-align: left; background: white;" | TSW200 |
| + | | style="text-align: left; background: white;" | TSW200 000050 |
| + | | style="text-align: left; background: white;" | No changes |
| + | |- |
| + | | style="text-align: left; background: white;" | Upcoming change date |
| + | | style="text-align: left; background: white;" colspan="2" | 2023 Q3 |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! colspan="3" style="text-align: left; background: white;" |Change impact |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" |Risk assessment |
| + | | colspan="2" style="width: 908px; text-align: left; background: white;" | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement. |
| + | |- |
| + | | style="text-align: left; background: white;" |Suggested implementation plan |
| + | | colspan="2" style="text-align: left; background: white;" | |
| + | Information included in this PCN will help adapt to the upcoming changes. For more detailed information please contact your sales representative. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="width: 1141px; text-align: left; background: white;" colspan="3" | Acknowledgement of PCN receipt |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
| + | |- |
| + | |} |
| + | |
| + | To download the pdf version of this notification, [[Media:PCN TSW200 2023 05 17 EN Packaging 050.pdf|click here]]. |
| + | |
| + | ==<s>2023.04.17: Product packaging changes</s> == |
| + | |
| + | Starting from Q3 2023 TSW200 product packaging will be changed. |
| + | |
| + | |
| + | |
| + | TSW200 PCN "'''2023.04.17: Product packaging changes'''" was updated with the information and is replaced with [[TSW200 Product Change Notifications#2023.05.17: Product packaging changes|TSW200 PCN "2023.05.17: Product packaging changes"]]. |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: white;" colspan="3" | Change description |
| + | |- |
| + | | style="text-align: left; background: white;" | Change type |
| + | | style="text-align: left; background: white;" colspan="2" | Packaging |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description |
| + | | style="width: 908px; text-align: left; background: white;" colspan="2" | Starting from Q3 2023 TSW200 polyurethane foam insert will be replaced by honeycomb insert made from cardboard. |
| + | |- |
| + | | style="text-align: left; background: white;" | Current design: <br><br> [[File:Insert_Plastic_OLD_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Plastic_OLD_TSW200.TSW210_v1.png]] |
| + | | style="text-align: left; background: white;" | Updated packaging design: <br><br> [[File:Insert_Carton_NEW_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Carton_NEW_TSW200.TSW210_v1.png]] |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="2" | Packaging dimensions will not change. |
| + | |- |
| + | | style="text-align: left; background: white;" | Change reasons |
| + | | style="text-align: left; background: white;" colspan="2" | This change will improve structural stability, enhance impact resistance, and reduce environmental impact. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="text-align: left; background: white;" colspan="3" | Affected products information |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" | Model |
| + | | style="width: 448px; text-align: left; background: white;" | Current order code |
| + | | style="width: 448px; text-align: left; background: white;" | New order code |
| + | |- |
| + | | style="text-align: left; background: white;" | TSW200 |
| + | | style="text-align: left; background: white;" | TSW200 ****** |
| + | | style="text-align: left; background: white;" | No changes |
| + | |- |
| + | | style="text-align: left; background: white;" | Upcoming change date |
| + | | style="text-align: left; background: white;" colspan="2" | 2023 Q3 |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! colspan="3" style="text-align: left; background: white;" |Change impact |
| + | |- |
| + | | style="width: 221px; text-align: left; background: white;" |Risk assessment |
| + | | colspan="2" style="width: 908px; text-align: left; background: white;" | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement. |
| + | |- |
| + | | style="text-align: left; background: white;" |Suggested implementation plan |
| + | | colspan="2" style="text-align: left; background: white;" | |
| + | Information included in this PCN will help adapt to the upcoming changes. For more detailed information please contact your sales representative. |
| + | |- |
| + | |} |
| + | |
| + | {| class="wikitable" |
| + | |+ |
| + | ! style="width: 1141px; text-align: left; background: white;" colspan="3" | Acknowledgement of PCN receipt |
| + | |- |
| + | | style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
| + | |- |
| + | |} |
| + | |
| + | To download the pdf version of this notification, [[Media:PCN TSW210 2023 04 17 EN Packaging.pdf|click here]]. |
| | | |
| {{Template:MAC Address Range Change PCN}} | | {{Template:MAC Address Range Change PCN}} |