Changes

Line 3: Line 3:  
}}
 
}}
 
__TOC__
 
__TOC__
 +
 +
{{Template:2023 12 18 PCN Housing
 +
<!------------------------DEVICE----------------------->
 +
| name        = TSW200
 +
| month        = July
 +
| Full_date    = 2024.03.19
 +
| File_Full_date    = 2024_03_19
 +
}}
 +
 +
==2024.03.19 TSW200 DIN Rail bracket change==
 +
 +
Starting from 2024 Q2, TSW200 switch will be produced with integrated DIN Rail bracket.
 +
{| class="wikitable"
 +
|-
 +
| style="width: 1219px; text-align: left; background: #eeece1;" |PCN Number: PCN_TSW200_2023.03.19<br>
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
!  colspan="3" style="text-align: left; background: #eeece1;" |Change description
 +
|-
 +
| style="text-align: left; background: white;" | Change type
 +
| style="text-align: left; background: white;" colspan="2" | Mechanical
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description
 +
| style="width: 908px; text-align: left; background: white;" colspan="2" |
 +
Beginning in Q2 of 2024, the current screw-on DIN Rail bracket in the TSW200 switch will be replaced with an integrated one. The new DIN Rail bracket will be shifted to the left by 0.96 mm.
 +
 +
Please note that this change will be implemented gradually, throughout a 3-month transitional period starting from Q2 2024, batch 33. During this period, your shipments of TSW210 may consist of either the current screw-on DIN Rail bracket or the new one described above. For inquiries regarding custom order codes, please contact your designated sales representative.
 +
|-
 +
| style="text-align: left; background: white;" | Old DIN Rail bracket: <br> [[File:TSW2_panel_old_v2.png|center|230px|link=Special:FilePath/TSW2_panel_old_v2.png]]<br>
 +
| style="text-align: left; background: white;" | New DIN Rail bracket: <br><br> [[File:TSW2_panel_new.png|center|210px|link=Special:FilePath/TSW2_panel_new.png]]<br>
 +
|-
 +
| style="text-align: left; background: white;" | Dimensions of old DIN Rail bracket:
 +
<br>
 +
[[File:dimensions_old_DIN.png|center|450px|link=Special:FilePath/dimensions_old_DIN.png]]<br>
 +
| style="text-align: left; background: white;" |  Dimensions of new DIN Rail bracket: <br><br> [[File:dimensions_new_DIN.png|center|450px|link=Special:FilePath/dimensions_new_DIN.png]]<br>
 +
|-
 +
| style="text-align: left; background: white;" colspan="3" | Packaging dimensions will not change.
 +
|-
 +
| style="text-align: left; background: white;" | Change reasons
 +
| style="text-align: left; background: white;" colspan="2" | Structural improvement
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: #eeece1;" colspan="3" | Affected products information
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Model
 +
| style="width: 448px; text-align: left; background: white;" | Affected order codes
 +
| style="width: 448px; text-align: left; background: white;" | Order code changes
 +
|-
 +
| style="text-align: left; background: white;" | TSW200
 +
| style="text-align: left; background: white;" | TSW200 ******
 +
| style="text-align: left; background: white;" | No changes
 +
|-
 +
| style="text-align: left; background: white;" | Upcoming change date
 +
| style="text-align: left; background: white;" colspan="2" | 2024 Q2
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: #eeece1;" colspan="3" | Change impact
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Risk assessment
 +
| style="width: 908px; text-align: left; background: white;" colspan="2"|
 +
The product handling process may require review. Marketing materials, such as photos, might need replacement.
 +
|-
 +
| style="text-align: left; background: white;" | Suggested implementation plan
 +
| style="text-align: left; background: white;" colspan="2"| Information included in this PCN will help adapt to the upcoming changes. For more detailed information, please contact your sales representative.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="width: 1141px; text-align: left; background: #eeece1;" colspan="3" | Acknowledgement of PCN receipt
 +
|-
 +
| style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above.
 +
|-
 +
|}
 +
 +
To download the pdf version of this notification, [[Media:TSW200_DIN_Rail_bracket_change.pdf|click here]].
 +
 +
==2024.01.18: EEPROM Change==
 +
 +
Starting from 2024 Q2, TSW200 switch will be produced with a different EEPROM hardware component.
 +
 +
{| class="wikitable"
 +
|-
 +
| style="width: 1219px; text-align: left; background: #eeece1;" |PCN Number: PCN_TSW200_2024_01_18_EN <br>
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! colspan="2" style="text-align: left; background: #eeece1;" |Change description
 +
|-
 +
| style="text-align: left; background: white;" |Change type
 +
| style="text-align: left; background: white;" |Hardware change
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Detailed description
 +
| style="width: 908px; text-align: left; background: white;" | In order to reduce lead times for TSW200 switch, starting from 2024 Q2, the EEPROM hardware component will be replaced with an analog part.<br>
 +
|-
 +
| style="text-align: left; background: white;" | Change reasons
 +
| style="text-align: left; background: white;" | Decreasing product lead time
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: #eeece1;" colspan="3" | Affected products information
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Model
 +
| style="width: 448px; text-align: left; background: white;" | Affected order codes
 +
| style="width: 448px; text-align: left; background: white;" | Order code changes
 +
|-
 +
| style="text-align: left; background: white;" | TSW200
 +
| style="text-align: left; background: white;" | TSW200 *****
 +
| style="text-align: left; background: white;" | No changes
 +
|-
 +
| style="text-align: left; background: white;" | Upcoming change date
 +
| style="text-align: left; background: white;" colspan="2" | 2024 Q2
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: #eeece1;" colspan="3" | Change impact
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Risk assessment
 +
| style="width: 908px; text-align: left; background: white;" colspan="2"| No risk factors have been identified during the evaluation of this change. However, it is recommended to conduct an independent review to ensure alignment with specific circumstances and requirements
 +
|-
 +
| style="text-align: left; background: white;" | Suggested implementation plan
 +
| style="text-align: left; background: white;" colspan="2"| No implementation plan needed.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="width: 1141px; text-align: left; background: #eeece1;" colspan="3" | Acknowledgement of PCN receipt
 +
|-
 +
| style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above.
 +
|-
 +
|}
 +
 +
To download the pdf version of this notification, [[Media:PCN TSW200 2024 01 18 EN.pdf|click here]].
 +
{{Template: 20230802_Product_packaging_changes
 +
<!------------------------DEVICE----------------------->
 +
| name        = TSW200
 +
}}
 +
 +
==2023.05.20: Product packaging changes ==
 +
 +
Starting in Q2 of 2023, changes will be made to the packaging of the TSW200 product.
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: white;" colspan="3" | Change description
 +
|-
 +
| style="text-align: left; background: white;" | Change type
 +
| style="text-align: left; background: white;" colspan="2" | Packaging
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description
 +
| style="width: 908px; text-align: left; background: white;" colspan="2" | Starting from Q2 2023, the current polyurethane foam insert used for TSW200 will be substituted with a honeycomb insert made from cardboard.
 +
|-
 +
| style="text-align: left; background: white;" | Current: <br> [[File:Polyurethane foam insert TSW v1.jpg|left|300px|link=Special:FilePath/Polyurethane foam insert TSW v1.jpg]]
 +
| style="text-align: left; background: white;" | New: <br> [[File:RUTX09-RUTX11-honeycomb-insert-v1.jpg|left|500px|link=Special:FilePath/RUTX09-RUTX11-honeycomb-insert-v1.jpg]]
 +
|-
 +
| style="text-align: left; background: white;" colspan="2" | Packaging dimensions will not change.
 +
|-
 +
| style="text-align: left; background: white;" | Change reasons
 +
| style="text-align: left; background: white;" colspan="2" | This change will lead to an improvement in the structural stability, impact resistance, and environmental impact reduction.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: white;" colspan="3" | Affected products information
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Model
 +
| style="width: 448px; text-align: left; background: white;" | Current order code
 +
| style="width: 448px; text-align: left; background: white;" | Order code changes
 +
|-
 +
| style="text-align: left; background: white;" | TSW200
 +
| style="text-align: left; background: white;" | TSW200 000040
 +
| style="text-align: left; background: white;" | No changes
 +
|-
 +
| style="text-align: left; background: white;" | Upcoming change date
 +
| style="text-align: left; background: white;" colspan="2" | 2023 Q2
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! colspan="3" style="text-align: left; background: white;" |Change impact
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" |Risk assessment
 +
| colspan="2" style="width: 908px; text-align: left; background: white;" | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement.
 +
|-
 +
| style="text-align: left; background: white;" |Suggested implementation plan
 +
| colspan="2" style="text-align: left; background: white;" |
 +
The information included in this PCN will help adapt to the upcoming changes. For more detailed information, please get in touch with your sales representative.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="width: 1141px; text-align: left; background: white;" colspan="3" | Acknowledgement of PCN receipt
 +
|-
 +
| style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above.
 +
|-
 +
|}
 +
 +
To download the pdf version of this notification, [[Media:PCN TSW200 2023 05 20 EN Packaging 040.pdf|click here]].
 +
 +
 +
 +
==2023.05.17: Product packaging changes ==
 +
 +
Starting from Q3 2023 TSW200 product packaging will be changed.
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: white;" colspan="3" | Change description
 +
|-
 +
| style="text-align: left; background: white;" | Change type
 +
| style="text-align: left; background: white;" colspan="2" | Packaging
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description
 +
| style="width: 908px; text-align: left; background: white;" colspan="2" | Starting from Q3 2023 TSW200 polyurethane foam insert will be replaced by honeycomb insert made from cardboard.
 +
|-
 +
| style="text-align: left; background: white;" | Current: <br><br> [[File:Insert_Plastic_OLD_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Plastic_OLD_TSW200.TSW210_v1.png]]
 +
| style="text-align: left; background: white;" | New: <br><br> [[File:Insert_Carton_NEW_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Carton_NEW_TSW200.TSW210_v1.png]]
 +
|-
 +
| style="text-align: left; background: white;" colspan="2" | Packaging dimensions will not change.
 +
|-
 +
| style="text-align: left; background: white;" | Change reasons
 +
| style="text-align: left; background: white;" colspan="2" | This change will improve structural stability, enhance impact resistance, and reduce environmental impact.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: white;" colspan="3" | Affected products information
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Model
 +
| style="width: 448px; text-align: left; background: white;" | Current order code
 +
| style="width: 448px; text-align: left; background: white;" | New order code
 +
|-
 +
| style="text-align: left; background: white;" | TSW200
 +
| style="text-align: left; background: white;" | TSW200 000050
 +
| style="text-align: left; background: white;" | No changes
 +
|-
 +
| style="text-align: left; background: white;" | Upcoming change date
 +
| style="text-align: left; background: white;" colspan="2" | 2023 Q3
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! colspan="3" style="text-align: left; background: white;" |Change impact
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" |Risk assessment
 +
| colspan="2" style="width: 908px; text-align: left; background: white;" | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement.
 +
|-
 +
| style="text-align: left; background: white;" |Suggested implementation plan
 +
| colspan="2" style="text-align: left; background: white;" |
 +
Information included in this PCN will help adapt to the upcoming changes. For more detailed information please contact your sales representative.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="width: 1141px; text-align: left; background: white;" colspan="3" | Acknowledgement of PCN receipt
 +
|-
 +
| style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above.
 +
|-
 +
|}
 +
 +
To download the pdf version of this notification, [[Media:PCN TSW200 2023 05 17 EN Packaging 050.pdf|click here]].
 +
 +
==<s>2023.04.17: Product packaging changes</s> ==
 +
 +
Starting from Q3 2023 TSW200 product packaging will be changed.
 +
 +
 +
 +
TSW200 PCN "'''2023.04.17: Product packaging changes'''" was updated with the information and is replaced with [[TSW200 Product Change Notifications#2023.05.17: Product packaging changes|TSW200 PCN "2023.05.17: Product packaging changes"]].
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: white;" colspan="3" | Change description
 +
|-
 +
| style="text-align: left; background: white;" | Change type
 +
| style="text-align: left; background: white;" colspan="2" | Packaging
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" rowspan="3" | Detailed description
 +
| style="width: 908px; text-align: left; background: white;" colspan="2" | Starting from Q3 2023 TSW200 polyurethane foam insert will be replaced by honeycomb insert made from cardboard.
 +
|-
 +
| style="text-align: left; background: white;" | Current design: <br><br> [[File:Insert_Plastic_OLD_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Plastic_OLD_TSW200.TSW210_v1.png]]
 +
| style="text-align: left; background: white;" | Updated packaging design: <br><br> [[File:Insert_Carton_NEW_TSW200.TSW210_v1.png|left|400px|link=Special:FilePath/Insert_Carton_NEW_TSW200.TSW210_v1.png]]
 +
|-
 +
| style="text-align: left; background: white;" colspan="2" | Packaging dimensions will not change.
 +
|-
 +
| style="text-align: left; background: white;" | Change reasons
 +
| style="text-align: left; background: white;" colspan="2" | This change will improve structural stability, enhance impact resistance, and reduce environmental impact.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="text-align: left; background: white;" colspan="3" | Affected products information
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" | Model
 +
| style="width: 448px; text-align: left; background: white;" | Current order code
 +
| style="width: 448px; text-align: left; background: white;" | New order code
 +
|-
 +
| style="text-align: left; background: white;" | TSW200
 +
| style="text-align: left; background: white;" | TSW200 ******
 +
| style="text-align: left; background: white;" | No changes
 +
|-
 +
| style="text-align: left; background: white;" | Upcoming change date
 +
| style="text-align: left; background: white;" colspan="2" | 2023 Q3
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! colspan="3" style="text-align: left; background: white;" |Change impact
 +
|-
 +
| style="width: 221px; text-align: left; background: white;" |Risk assessment
 +
| colspan="2" style="width: 908px; text-align: left; background: white;" | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement.
 +
|-
 +
| style="text-align: left; background: white;" |Suggested implementation plan
 +
| colspan="2" style="text-align: left; background: white;" |
 +
Information included in this PCN will help adapt to the upcoming changes. For more detailed information please contact your sales representative.
 +
|-
 +
|}
 +
 +
{| class="wikitable"
 +
|+
 +
! style="width: 1141px; text-align: left; background: white;" colspan="3" | Acknowledgement of PCN receipt
 +
|-
 +
| style="text-align: left; background: white;" colspan="3"| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above.
 +
|-
 +
|}
 +
 +
To download the pdf version of this notification, [[Media:PCN TSW210 2023 04 17 EN Packaging.pdf|click here]].
 +
 +
{{Template:MAC Address Range Change PCN}}
    
==2022.10.24: QSG flyer replacement==
 
==2022.10.24: QSG flyer replacement==
Line 18: Line 370:  
| style="width: 908px; text-align: left; background: white;" colspan="2" | TSW200 devices manufactured starting from Q4 2022 will have a new QSG flyer in the packaging. The new QSG flyer includes the short version of QSG with a QR code/link to the full Web QSG version: [https://teltonika-networks.com/QSG_TSW200 teltonika-networks.com/QSG_TSW200].
 
| style="width: 908px; text-align: left; background: white;" colspan="2" | TSW200 devices manufactured starting from Q4 2022 will have a new QSG flyer in the packaging. The new QSG flyer includes the short version of QSG with a QR code/link to the full Web QSG version: [https://teltonika-networks.com/QSG_TSW200 teltonika-networks.com/QSG_TSW200].
 
|-
 
|-
| style="text-align: left; background: white;" | Previous design:<br> [[File:TSW200_old_QSG_v1.png|center|300px]]
+
| style="text-align: left; background: white;" | Previous design:<br> [[File:TSW200_old_QSG_v1.png|center|300px|link=Special:FilePath/TSW200_old_QSG_v1.png]]
| style="text-align: left; background: white;" | New design: <br> [[File:TSW200_new_QSG_v1.png|center|300px]]
+
| style="text-align: left; background: white;" | New design: <br> [[File:TSW200 new QSG v1.png|center|300px|link=Special:FilePath/TSW200 new QSG v1.png]]
 
|-
 
|-
 
| style="text-align: left; background: white;" colspan="2" | The new flyer will include QR codes with URL links to RMS and the Web version of the QSG (Quick Start Guide) for the TSW200.
 
| style="text-align: left; background: white;" colspan="2" | The new flyer will include QR codes with URL links to RMS and the Web version of the QSG (Quick Start Guide) for the TSW200.

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