TSW114 Product Change Notifications
Product change notifications (PCN) is way of informing customers of upcoming changes related to Teltonika products. This includes outward appearance adjustments, hardware improvements, changes to package contents, etc.
This page stores information regarding changes made to the TSW114 device. Below you will find a list of both upcoming and already implemented changes sorted from newest to oldest (top to bottom).
2024.03.07: TSW114 DIN Rail change
Starting from 2024 Q1, TSW114 switch will be produced with integrated DIN Rail bracket.
| PCN Number: PCN_TSW114_2023.03.08 |
| Change description | ||
|---|---|---|
| Change type | Mechanical | |
| Detailed description |
Beginning in Q1 of 2024, the current screw-on DIN Rail bracket in the TSW114 switch will be replaced with an integrated one | |
Old DIN Rail bracket:  |
Old DIN Rail bracket:  | |
New DIN Rail bracket:  |
New DIN Rail bracket:  | |
| Packaging dimensions will not change. | ||
| Change reasons | Structural improvement | |
| Affected products information | ||
|---|---|---|
| Model | Affected order codes | Order code changes |
| TSW114 | TSW114 ****** | No changes |
| Upcoming change date | 2024 Q1 | |
| Change impact | ||
|---|---|---|
| Risk assessment |
The product handling process may require review. Marketing materials, such as photos, might need replacement. | |
| Suggested implementation plan | Information included in this PCN will help adapt to the upcoming changes. For more detailed information, please contact your sales representative. | |
| Acknowledgement of PCN receipt | ||
|---|---|---|
| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
To download the pdf version of this notification, click here.
2023.04.17: Product packaging changes
Starting from Q3 2023 TSW114 product packaging will be changed.
| Change description | ||
|---|---|---|
| Change type | Packaging | |
| Detailed description | Starting from Q3 2023 TSW114 polyurethane foam insert will be replaced by honeycomb insert made from cardboard. | |
Current design:  |
Updated packaging design:  | |
| Packaging dimensions will not change. | ||
| Change reasons | This change will improve structural stability, enhance impact resistance, and reduce environmental impact. | |
| Affected products information | ||
|---|---|---|
| Model | Current order code | New order code |
| TSW114 | TSW114 ****** | No changes |
| Upcoming change date | 2023 Q3 | |
| Change impact | ||
|---|---|---|
| Risk assessment | The product handling and storage process may require review. Marketing materials, such as photos, might need replacement. | |
| Suggested implementation plan |
Information included in this PCN will help adapt to the upcoming changes. For more detailed information please contact your sales representative. | |
| Acknowledgement of PCN receipt | ||
|---|---|---|
| If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above. |
To download the pdf version of this notification, click here.